| PART |
Description |
Maker |
| TC2491 |
0.5 W Flange Ceramic Packaged PHEMT GaAs Power FETs
|
Transcom, Inc.
|
| TC2996A |
1.6 GHz 12 W Flange Ceramic Packaged GaAs Power FETs
|
Transcom, Inc.
|
| TC2997A |
1.6 GHz 20 W Flange Ceramic Packaged GaAs Power FETs
|
Transcom, Inc.
|
| ACT845SMX-2 |
2 pad, cost competitive ceramic packaged, glass sealed crystal.
|
Advanced Crystal Technology
|
| QEHC49H3110LT5016 QEHC49H3130LT5016 QEHC49H3150LT5 |
SMD 3.2x2.5 Crystal -Ceramic SMD packaged
SMD 3.2x2.5 Crystal -Ceramic SMD packaged
|
TEMEX
http://
|
| CM415 |
TUNING FORK CRYSTAL WITH CERAMIC PACKAGED TYPE HIGH-DENSITY SMD TYPE
|
List of Unclassifed Manufacturers
|
| QEHC49H3130HT1016 QEHC49H3310DN5016 QEHC49H3310DN1 |
SMD 3.2x2.5 Crystal -Ceramic SMD packaged 贴片3.2x2.5水晶，陶瓷贴片封
|
Rakon France SAS
|
| PE44238 |
SMA Female Right Angle Connector Solder Attachment 2 Hole Flange Pin Terminal, .481 inch Hole Spacing, 45 Degree Flange Direction
|
Pasternack Enterprises, Inc.
|
| AS179-92LF AS197-306 |
APN2015:GaAs FETs as Control Devices|DC-6 GHz Plastic Packaged and Chip|SPST
AS197-306:PHEMT GaAs IC High Power SP2T and SP3T S|DC-6 GHz Plastic Packaged and Chip|SPST AS197 - 306：PHEMT的砷化镓集成电路高功率SP2T和SP3T秒|的DC - 6GHz的塑料包装和芯片|聚苯乙烯
|
Amphenol, Corp.
|
| CC0805ZRY5V6BB103 CC0805ZRY5V5BB103 CC0805ZRY5V7BB |
SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS14
SURFACE-MOUNT CERAMIC CERAMIC
SURFACE-MOUNT CERAMIC SURFACE-MOUNT CERAMIC
SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS
SURFACE-MOUNT CERAMIC CERAMIC
This cpecification describes Y5V series chip catacitors with lead-free terminations.
SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS14
|
YAGEO Corporation
List of Unclassifed Man...
|
| PD25 PD26 PD24 PS56 PS85 PS88 PS58 PS87 PS560 PS58 |
3 Phase Driver, Soft Turn-on, Inverting Input Separate High and Low Side Inputs, 200ns Deadtime.; A IR21363 packaged in a Lead-Free 28-Lead PDIP
3 Phase Driver, Separate High and Low Side Inputs, 200ns Deadtime in a 28-pin DIP package; A IR2135 packaged in a Lead-Free 28-Lead SOIC
High and Low Side Driver, All High Voltage Pins On One Side, Separate Logic and Power Ground, Shut-Down in a 14-pin DIP package; A IR2110 packaged
Half Bridge Driver, SoftTurn-On, Low Side Inverting Input, Separate High and Low Side Input, 500ns Deadtime in a 8-pin DIP package; A IR2183 packaged
3 Phase Driver, Soft Turn-on, Inverting Input Separate High and Low Side Inputs, 200ns Deadtime.; A IR21363 packaged in a Lead-Free 28-Lead SOIC
3 Phase Driver, Soft Turn-on, Inverting Input Separate High and Low Side Inputs, 200ns Deadtime.; A IR21367 packaged in a 28-Lead PDIP
Half Bridge Driver, Soft Turn-On, Single Input Plus Shut-Down, Fixed 500ns Deadtime in a 8-pin DIP package; A IR2109 packaged in a Lead-Free 8-Lead
Single High Side Driver, Noninverting Input in a 8-pin DIP package; A IR2117 packaged in a 8-Lead SOIC
High and Low Side Driver in a 14-pin DIP package; A IR2010 packaged in a Lead-Free 16-Lead SOIC
Half Bridge Driver, Soft Turn-On, Single Input Plus Shut-Down, Fixed 500ns Deadtime in a 8-pin DIP package; A IR2109 packaged in a 8-Lead SOIC
and Power Ground, Programmable Deadtime in a 14-pin DIP package; A IR21834 packaged in a 14-Lead PDIP
Single High Side Driver, Noninverting Input in a 8-pin DIP package; A IR2117 packaged in a 8-Lead PDIP
High voltage, high speed power MOSFET and IGBT driver with three independent high side and low side referenced output channels and with DC Bus
Single High Side Driver, Noninverting Inputs, Current Sensing, Overcurent Detection and Shutdown Fault Output in a 8-pin DIP package; A IR2127
Analog IC 模拟IC
3 Phase Driver, Separate High and Low Side Inputs, 200ns Deadtime in a 28-pin DIP package; A IR2135 packaged in a 28-Lead SOIC shipped on Tape and Reel 模拟IC
High and Low Side Driver, All High Voltage Pins On One Side, Separate Logic and Power Ground, Shut-Down in a 14-pin DIP package; A IR2110 packaged in a 16-Lead SOIC shipped on Tape and Reel
|
Lattice Semiconductor, Corp.
|
|
